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Title:
BONDING MATERIAL
Document Type and Number:
Japanese Patent JPS61100404
Kind Code:
A
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Inventors:
YOSHITAKE KENICHI
Application Number:
JP22235484A
Publication Date:
May 19, 1986
Filing Date:
October 23, 1984
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B27M1/00; B27M3/00; (IPC1-7): B27M1/00; B27M3/00
Attorney, Agent or Firm:
Miyai Akio



 
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