To provide a bonding method of a high-frequency connector applied to connection between an optical device or an electronic device operated at high speed of several 10 GHz by optical communication or the like and an electric driver driving the devices.
In this bonding method of a core of the connector for bonding a center conductor 16a formed on a developed substrate 15 to the core 7 of the connector arranged separately as far as a prescribed distance over the center conductor 16a by using a solder pellet 25, the solder pellet 25 is constituted so that one end side is thinner than the prescribed distance, and that the other end side is thicker than the prescribed distance, and heated with one end side of the solder pellet 25 inserted between the center conductor 16a and the core 7 of the connector which are separated by the prescribed distance, and the solder pellet 25 is melted to thereby bond the core 7 to the center conductor 16a.
IGARASHI NOBUHIRO
NANAMI MASAYA
| JP2002118190A | 2002-04-19 | |||
| JPH06326141A | 1994-11-25 | |||
| JP2007200920A | 2007-08-09 | |||
| JPH0621636A | 1994-01-28 | |||
| JP2004294918A | 2004-10-21 |
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