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Patent Searching and Data


Title:
BONDING METHOD FOR CYLINDRICAL FUSE LINK
Document Type and Number:
Japanese Patent JPH11185595
Kind Code:
A
Abstract:

To provide a bonding method for a cylindrical fuse link capable of firmly bonding a joining body with a dispersion in fitting size between a ceramic cylinder and a metal cap only by using a small quantity of adhesive.

A thickness of about 35 μm of conductive metal including a copper is applied to the circumference on the end face and side face of an outer cylinder 2 at a length equal to fit a cup-shaped cap with evaporation. Diameter of about 3.5 mm of cut holes are made in two places opposite the circumference at the end of the cup-shaped cap 1 fitted thereto and a very small quantity of adhesive is applied to the end of the outer cylinder 2. The outer cylinder is inserted into the cup-shaped cap 1 and a fixed number of solder pellets 5 are fitted into the cut hole and bonded and fixed with local heating or the cup-shaped cap 1 for the outer cylinder 2 is inserted into the outer cylinder 2 and then a fixed quantity of adhesive is filled in the cut hole to bond and fix the outer cylinder to the cup-shaped cap 1.


Inventors:
OSANAI NORIO
Application Number:
JP36995397A
Publication Date:
July 09, 1999
Filing Date:
December 18, 1997
Export Citation:
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Assignee:
ASAHI ELECTRIC MFG
International Classes:
H01H69/02; H01H85/02; H01H85/143; H01H85/157; H01H85/17; (IPC1-7): H01H85/157; H01H69/02