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Title:
BONDING METHOD FOR THIN SHEET
Document Type and Number:
Japanese Patent JPS58145774
Kind Code:
A
Abstract:

PURPOSE: To perform bonding a plurality of rectangular thin sheets efficiently and rapidly on the surface of a structure, by, while forming a plurality of rectangular thin sheets by cutting from a sheet tentatively bonded on the surface of a structure, positioning mutual locations of these sheets.

CONSTITUTION: A copper sheet S contg. a plurality of rectangular thin sheets (a), (b) and (c) is tentatively bonded with a double-sized adhesive on the surface of a structure H such as shipis hull, etc. Then, rectangular thin sheet (a) located at a corner of sheet S is formed by cutting along lines (X) so as to remove joints (Y) between rectangular thin sheet (a) and sheets (b), (b) next to sheet (a) and bonded to the original position with an adhesive. Likewise, after forming rectangular thin sheets (a) at four comes by cutting and bonding with an adhesive respectively, rectangular thin sheets (b), (c) positioned between sheets (a) at the corners are formed by cutting and bonded so as to remove joints (Y) between sheet (a) and sheet (b), or sheet (a) and sheet (c).


Inventors:
KANEZAKI AKISHI
Application Number:
JP2789082A
Publication Date:
August 30, 1983
Filing Date:
February 23, 1982
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
C09J5/00; B63B59/04; (IPC1-7): B63B59/04; C09J5/00
Attorney, Agent or Firm:
Yoshihiko Iinuma



 
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