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Title:
BONDING METHOD
Document Type and Number:
Japanese Patent JPS58171461
Kind Code:
A
Abstract:

PURPOSE: To attain high bonding strength by interposing a pressure-sensitive adhesive film consisting of a specific pressure-sensitive adhesive together with a liquid containing a polymerization initiator and a vinyl monomer capable of dissolving said adhesive between the faces to be bonded, contacting the face with each other under pressure, and polymerizing the vinyl monomer.

CONSTITUTION: A pressure-sensitive adhesive film composed of a pressure-sensitive adhesive (preferably an acrylic copolymer) containing preferably 0.1W5wt% of a polymerization initiator such as benzoyl peroxide or a polymerization accelerator such as cobalt naphthenate, is applied to a face to be bonded. A liquid composition composed of a vinyl monomer which is a solvent or swelling agent of the above adhesive (e.g. methyl methacrylate) and/or its oligomer (e.g. polyester methacrylate) and containing preferably 0.1W5wt% of the above polymerization initiator or the polymerization accelerator, is interposed partially between the pressure-sensitive adhesive film and the face to be bonded, and the film is pressed to the face to effect the polymerization of said vinyl monomer, etc. and bond the film to the face. The glass-transition temperature of the polymer of the vinyl monomer and/or oligomer is preferably ≥-20°C.


Inventors:
OKUNO TOSHIMITSU
HORI YUTAKA
TOMOMOTO TAKANOBU
SUNAKAWA MAKOTO
Application Number:
JP5441182A
Publication Date:
October 08, 1983
Filing Date:
March 31, 1982
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
C09J7/02; C09J4/00; C09J5/00; C09J5/06; (IPC1-7): C09J3/14; C09J5/00; C09J7/02
Domestic Patent References:
JPS5428877A1979-03-03



 
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