To provide a bonding structure that has a high yield rate without any residual air bubble in a predetermined region between work-pieces bonded together via an adhesive agent, and further to provide a manufacturing method thereof.

A bonding structure includes: a sealing portion 3 formed of an adhesive agent around a visual field range W on a work-piece S1; a portion 4 filled with the adhesive agent where the adhesive agent is filled inside the sealing portion 3; and a work-piece bonded to the sealing portion 3 and the portion 4 filled with the adhesive agent. The sealing portion 3 includes: bank portions 31 that protrude from a flat surface of the work-piece S1 on lines surrounding the visual field range W; cutout portions 31a where parts of the bank portions 31 are cut out; first changing portions 32 and second changing portions 33 for changing flowing directions of the adhesive agent flowing from the cutout potions 31a; and extending portions 34 for extending flowing passages of the adhesive agent.