Title:
BONDING STRUCTURE AND PIEZO-ACTUATOR
Document Type and Number:
Japanese Patent JP2023101213
Kind Code:
A
Abstract:
To provide a technique that enables easy determination as to whether the application of an adhesive is proper not.SOLUTION: A bonding structure includes a first member 11, an adhesive 13 applied to a part of a predetermined face 11A in the first member 11, and a second member 12 bonded to a part of the predetermined face 11A in the first member 11 with the adhesive 13. An index 11C is provided at the portion of the predetermined face 11A in the first member 11 that is not covered with the second member 12 and is also within a predetermined distance from the outer edge 12B of the second member 12. The index 11C is to determine whether the amount of the adhesive 13 squeezed out from between the first member 11 and the second member 12 is proper or not.SELECTED DRAWING: Figure 1
Inventors:
SHIRATO HIRONORI
Application Number:
JP2022001696A
Publication Date:
July 20, 2023
Filing Date:
January 07, 2022
Export Citation:
Assignee:
DENSO TEN LTD
International Classes:
C09J5/00; C09J201/00; F16B5/08; F16B11/00; H04R17/00
Attorney, Agent or Firm:
Patent Attorney Corporation Shuwa Patent Office