PURPOSE: To provide a semiconductor device of a structure wherein water from the outside is prevented from intruding into the interior of the device and the humidity resistance of the device is improved, and to provide a method of manufacturing the semiconductor device.

CONSTITUTION: In a semiconductor device having a bonding structure wherein at least two layers of bonding pads (3 and 4) are formed on an insulating film (2), the area of the region occupied by the bonding pad (4) which is the upper layer, is wider than that of the region occupied by the bonding pad (3) which is the lower layer, and both of ethe bonding pads have first and second sidewalls (21 and 22) made of an insulating material on their side parts. Therefore, water which tends to intrude from the outside is blocked by these sidewalls (21 and 22) and does never reach the interior of the device.