Title:
BONDING TOOL OF ELECTRONIC COMPONENT AND BONDING EQUIPMENT
Document Type and Number:
Japanese Patent JP3409688
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain excellent vibration application efficiency by installing a contact bonding surface for fixing an electronic component by pressure at a position corresponding to the loop of a standing wave of a horn which is vibrated by a vibrator, and constituting the section vertical to the longitudinal direction of the horn as a form in which flexural rigidity becomes maximum in the direction pressing the compression bonding surface against a surface to be fixed by pressure.
SOLUTION: A standing wave exited in a horn 15 has loops at a position of a mounting surface of a vibrator 17 and a position of a compression bonding surface 15f of a holding part 15e positioned, in the central part of the horn 15, and has nodes at a position of a fixing seat 15a as a fixing part for fixing the horn 15 to a block and a position of a suction hole 15b. That is, flexural rigidity becomes maximum in the direction where the compression bonding surface 15f is pressed against a board. While the size of a bonding tool 14 is maintained as small as possible, flexural rigidity can be maximized in the bonding load direction, so that deflection of the horn 15 is restrained to a minimum and excellent bonding is enabled.
Inventors:
Masashi Hinoki
Application Number:
JP11046198A
Publication Date:
May 26, 2003
Filing Date:
April 21, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B06B1/02; H01L21/60; H01L21/607; (IPC1-7): H01L21/60; H01L21/607
Domestic Patent References:
| JP5423349B2 | ||||
| JP3912783B1 |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)