Title:
BONDING WIRE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3871094
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make bonding wires uniform in mechanical strength.
SOLUTION: A wire contains 1 to 100 wt. ppm of one or more elements selected from among rare elements, such as Be, Mg, Ca, Ge, Sn, In, Pb, Pd, Pt, Cu, Ag, and Y, the C content of the wire is set less than 1 wt. ppm, and the remainder includes Au and unavoidable impurities. The wire is cast by the use of a crucible of BeO, MgO, or ThO2 which contains less than 0.1 wt.% impurities.
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Inventors:
Masao Naito
Application Number:
JP8064498A
Publication Date:
January 24, 2007
Filing Date:
March 27, 1998
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
H01L21/60; C22C1/02; C22C5/02; F27B14/10; (IPC1-7): H01L21/60; C22C1/02; C22C5/02; //F27B14/10
Domestic Patent References:
| JP62101061A | ||||
| JP6336627A |
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