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Patent Searching and Data


Title:
BONDING WIRE
Document Type and Number:
Japanese Patent JP01162343
Kind Code:
A
Abstract:

PURPOSE: To inhibit the age sofening of Ag in a mounting state subsequent to bonding to improve its mechanical characteristics and also, to contrive to stabilize the hardness of a ball by a method wherein a prescribed amount of Ca is added to the high-purity Ag.

CONSTITUTION: Ca, 0.0005W0.02wt.%, is added to high-purity Ag. According to such a way, as the recrystallization temperature of a core material is enhanced and the age softening of the Ag can be inhibited to hold a high tensile strength, the mechanical nature of the Ag can be improved. Moreover, as the upper limit of the amount of added Ca is regulated, a ball, which is formed at the time of bonding, is sufficiently soft and also, becomes one near a true sphere. As a result, a failure of an Si chip can be prevented and the reliability of a bonding work can be improved.


Inventors:
Morita, Akiyasu
Matsushita, Tomiharu
Application Number:
JP1987000322076
Publication Date:
June 26, 1989
Filing Date:
December 18, 1987
Export Citation:
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Assignee:
KOBE STEEL LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60