Title:
BONDING WIRE
Document Type and Number:
Japanese Patent JP2017084866
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a bonding wire having a core material including Ag as a primary component, which can prevent the sulfurization of a wire surface before and after boding.SOLUTION: Used is a bonding wire comprising: a core material 12 including 75 mass% or more of Ag; and a metal coating layer 14 covering the outer peripheral face of the core material 12. The metal coating layer 14 includes 90 mass% or more of at least one element selected from a group consisting of Sn, Zn and In. The metal coating layer is 0.01 μm or more in thickness.SELECTED DRAWING: Figure 1
Inventors:
DOI SATOKO
KOSHINAKA HIROYUKI
IDE KENZO
KOSHINAKA HIROYUKI
IDE KENZO
Application Number:
JP2015208761A
Publication Date:
May 18, 2017
Filing Date:
October 23, 2015
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD
International Classes:
H01L21/60; C22C5/06; C22F1/14
Foreign References:
| WO2013129253A1 | 2013-09-06 |
Attorney, Agent or Firm:
Masato Tsuda
Tetsuji Nakamura
Katsuyuki Tomita
Husband
Ariyoshi Yasuomi
Ryu Maesawa
Tamako Tsutada
Tetsuji Nakamura
Katsuyuki Tomita
Husband
Ariyoshi Yasuomi
Ryu Maesawa
Tamako Tsutada
Previous Patent: Coil unit
Next Patent: It is a current limiting resistor for tap changers at the time of load.
Next Patent: It is a current limiting resistor for tap changers at the time of load.