Title:
BONDING WIRE
Document Type and Number:
Japanese Patent JPH01243310
Kind Code:
A
Abstract:
PURPOSE: To make the bonding possible even if there is no preliminary solder layer on a pad by providing a solder layer between the conductor portion and the insulating layer.
CONSTITUTION: A bonding wire 10, formed from a conductor portion 1, an insulating layer 2, a protecting layer 3, etc., is provided with a solder layer 4 between the layers 1, 2 so as to make it possible to carry out the bonding treatment by utilizing the layer 4 even if there is no preliminary solder layer, such as a solder ball or the like, on a pad 15.
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Inventors:
SUEHIRO MITSUO
Application Number:
JP7165588A
Publication Date:
September 28, 1989
Filing Date:
March 24, 1988
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01R4/02; H01B5/02; H01B7/00; (IPC1-7): H01B5/02; H01B7/00; H01R4/02
Attorney, Agent or Firm:
Sadaichi Igita
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