接合体、回路基板、および半導体装置

Title:

接合体、回路基板、および半導体装置

Document Type and Number:

Japanese Patent JP7013374

Kind Code:

B2

Abstract:

This bonding body is provided with a ceramic member and a copper member bonded to the ceramic member via a bonding layer. The nano-indentation hardness HIT of the bonding layer is 1.0-2.5 GPa inclusive.

More Like This:

JP2000016878

BONDED STRUCTURE

Inventors:

Masashi Umehara
Hiromasa Kato
Takayuki Nanami

Application Number:

JP2018530386A

Publication Date:

January 31, 2022

Filing Date:

July 27, 2017

Export Citation:

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Assignee:

Toshiba Corporation
Toshiba Materials Co., Ltd.

International Classes:

C04B37/02; H01L23/13; H05K1/03; H05K3/32; H05K3/34; H05K3/38

Foreign References:

WO2011034075A1
WO2010137651A1
WO2017056360A1
WO2013094213A1
WO2014054609A1

Attorney, Agent or Firm:

Patent Business Corporation Sakura International Patent Office

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