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Title:
BORON-PHOSPHIDE BASED ELEMENT AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003188105
Kind Code:
A
Abstract:

To stably obtain an n-type or p-type boron-phosphide based semiconductor layer with precisely controlled carrier density by adding n-type or p-type impurities when the boron-phosphide based semiconductor layer is formed by a vapor-phase growing means.

In a state wherein boron occupying holes of phosphorus is present higher than the atom density of phosphorus occupying holes of boron in an undoped state, p-type impurities of a group II or IV group element are added to obtain a boron-phosphide based compound semiconductor layer. In a state wherein phosphorus occupying holes of boron is present higher than the atom density of boron occupying holes of phosphorus of boron in the undoped state, n-type impurities of a group IV or VI element to obtain an n-type boron-phosphide based compound semiconductor layer.


Inventors:
UDAGAWA TAKASHI
Application Number:
JP2001381988A
Publication Date:
July 04, 2003
Filing Date:
December 14, 2001
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
H01L21/18; H01L21/205; H01L33/26; (IPC1-7): H01L21/205; H01L33/00
Attorney, Agent or Firm:
Shinji Kakinuma