To provide a bottomed via filling substrate that is easily filled with a paste even when a via diameter is extremely small and a method of manufacturing the same.

A mask opening 64 is elliptical with a minor axis equal to or less than the diameter of a bottomed via 56, and so the bottomed via 56 cannot be closed by conductor paste 58 when applying the conductor paste. Accordingly, the air in the bottomed via 56 is pushed out of the air gap between the mask opening 64 and the via 56 opening, so that void formation by the involved air in the bottomed via 56 is suppressed. In addition, an opening area of the mask opening 64 is equal to or larger than that of the bottomed via 56, and so more than half of the opening area of the bottomed via 56 is located in the mask opening 64. As a result, a sufficient amount of conductor paste 58 is supplied, and the amount of the paste 58 directly applied in the bottomed via 56 becomes sufficiently large, thereby the inside of the via bottomed 56 is easily filled with the conductor paste 58.