To provide a brazing evaluating apparatus capable of nondestructively evaluating the brazed condition of a brazed part and deciding the success or the failure of a joint.

This brazing evaluating apparatus evaluates the soldered condition of a solder ball 8 soldered to a pad of an insulation substrate 7 of a semiconductor device 4, and the semiconductor substrate 4 is mounted on a support stand 4 of a thermal image measuring part 1, and the surface temperature of the solder ball 8, when the soldered part is heated, is photographed by a thermal image measuring camera 2, and an obtained image signal is input to a thermal image analyzer 9 to calculate the increase in the temperatures the surface temperatures of the solder ball 8, and the thermal image analyzer 9 compares it with the temperature increase characteristic set previously, evaluates the solder conditions, and determines the quality of a joint.