Title:
ブレイク装置
Document Type and Number:
Japanese Patent JP6578759
Kind Code:
B2
Abstract:
According to the present invention, there is provided a cutting device capable of maintaining an appropriate indentation amount of a cutting bar without being affected by the thickness of a semiconductor substrate, a protective film, and a dicing tape. The cutting device presses the cutting bar (7) into a semiconductor substrate (W) having a scribe line (S) on the surface to divide the substrate, one side of the semiconductor substrate (W) is covered with a protective film (3), and a dicing tape (2) is attached to the opposite side. The structure of the cutting device includes a workbench (4) for placing the semiconductor substrate (W) together with the protective film (3) and the dicing tape (2); a displacement gauge (10) for measuring the surface height of the protective film (3) or the dicing tape (2) placed on the upper surface side of the semiconductor substrate (W) of the workbench (4), and a computer (C) control part (11) that subtracts the displacement amount to the specified indentation amount of the cutting bar (7) to enable the cutting bar (7) to be lifted and lowered under the condition that the measured value obtained by the displacement gauge (10) has displacement relative to the pressing starting position of the cutting bar (7).
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Inventors:
Kuriyama Noriyoshi
Makoto Takeda
Kenji Murakami
Hashimoto City
Makoto Takeda
Kenji Murakami
Hashimoto City
Application Number:
JP2015129600A
Publication Date:
September 25, 2019
Filing Date:
June 29, 2015
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
H01L21/301
Domestic Patent References:
| JP4199471B2 | ||||
| JP2004119901A | ||||
| JP4855097B2 | ||||
| JP2011033372A | ||||
| JP11090900A | ||||
| JP2014082241A | ||||
| JP2009295757A | ||||
| JP2006108503A |
Foreign References:
| US20070048972 |
Attorney, Agent or Firm:
Yoshio Kashima