To provide a bubble detection method, a resist application method, and a resist application device with which it is possible to suppress elution of an impurity, such as a metal, into a photoresist and detect a flow amount of the photoresist and presence or absence of bubbles in the photoresist.
A flow amount sensor includes resin-made piping through which a fluid is caused to flow, a heating mechanism provided outside the resin-made piping and used to heat the fluid, and a temperature detection mechanism provided outside the resin-made piping and used to detect a temperature change resulting from the flow of the fluid. The flow amount sensor is provided for a photoresist supply piping through which a photoresist is caused to flow. Based on a signal from the flow amount sensor, a flow amount of the photoresist flowing through the photoresist supply piping is detected and presence or absence of bubbles in the photoresist is detected.
MINAMI TOMOHIDE
ISHIDA HISAKI
YAMAMOTO TAKASHI
ISHIKAWA SHINYA
