Title:
BUFFER BOARD STRUCTURE OF TREADMILL
Document Type and Number:
Japanese Patent JP2016123872
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent buffer-related breakdown between a bamboo sheet of a bamboo layer and a thin layer, and obtain a smooth buffer effect and stable juxtaposition when being stepped.SOLUTION: A buffer board structure 100 of a treadmill comprises bamboo layers 1 juxtaposing and bonding bamboo sheets 10. Thin layers 2 are bonded on upper and lower surfaces of the bamboo sheet 10. The bamboo sheets 10 are firmly stacked above and below the thin layers 2. Each thin layer 2 has an upper surface and a lower surface, respectively, and are stacked between the bamboo layers 1. The bamboo sheets 10 of the bamboo layers 1 face the same juxtaposition direction. Each bamboo layer 1 juxtaposed in the longitudinal direction provides a better buffer. One thin layer 2 is set between the two bamboo layers 1. Thereby, a contact surface of the bamboo layer 1 and the thin layer 2 is integrally bonded and gets smooth, and adhesives 3 fill the gaps further uniformly. An anti-slip layer 4 is stuck on the bamboo layer 1 of the top.SELECTED DRAWING: Figure 1
Inventors:
CHANG CHUNG-FU
Application Number:
JP2015257744A
Publication Date:
July 11, 2016
Filing Date:
December 31, 2015
Export Citation:
Assignee:
CHANG CHUNG-FU
International Classes:
A63B22/02
Domestic Patent References:
| JP2011217971A | 2011-11-04 |
Foreign References:
| US20110111166A1 | 2011-05-12 |
Attorney, Agent or Firm:
Takahiro Ozaki