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Patent Searching and Data


Title:
BUILDING BOARD MATERIAL
Document Type and Number:
Japanese Patent JPH11350633
Kind Code:
A
Abstract:

To provide a daylighting board material which facilitates the construction and is superior in sound insulating performance, heat insulating performance, and shock resistance.

A building board material 50 is constituted of a board main body part 51 which are formed by superposing two resin rectangular plates 61, 62 via a lot of mutually parallel ribs 63 crossing at right angles with the respective plates and extended in the length direction of the plates, and a pair connecting parts 52a, 52b which is formed in both side surface parts 51a, 51b in parallel to the ribs 63 of the board main body part 51 and connect a plurality of the board main body parts 51 approximately flush in the adjacent to each other.


Inventors:
KIKUCHI IICHIRO
HIRAMOTO YASUSHI
Application Number:
JP16373298A
Publication Date:
December 21, 1999
Filing Date:
June 11, 1998
Export Citation:
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Assignee:
DAINIPPON PLASTICS
International Classes:
E04F13/18; E04B2/00; E04B2/72; E04B5/02; E04C2/08; E04F15/10; (IPC1-7): E04B2/72; E04B2/00; E04B5/02; E04C2/08; E04F13/18; E04F15/10
Attorney, Agent or Firm:
Shintaro Nogawa