Title:
建築板
Document Type and Number:
Japanese Patent JP6687338
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a building board in which a gap is hardly generated between adjacent building boards, and a building board fixed to a structural material is hardly exfoliated, even when the inorganic building board having a core layer and a skin layer is exposed to a high temperature.SOLUTION: In a building board 1 including a core layer 2 formed of a molding material containing a hydraulic inorganic material, and a skin layer 3 formed of the molding material containing the hydraulic inorganic material, and covering the core layer 2, an absolute dry specific gravity of the skin layer 3 is higher than an absolute dry specific gravity of the core layer 2, and a strength heat shrinkage of the skin layer 3 is 10% or lower, and a strength heat shrinkage of the core layer 2 is 13% or lower.SELECTED DRAWING: Figure 1
Inventors:
Tomohisa Yamamoto
Takashi Komiya
Hiroyuki Shiromoto
Yusaku Okajima
Takuro Kitamura
Takashi Komiya
Hiroyuki Shiromoto
Yusaku Okajima
Takuro Kitamura
Application Number:
JP2015132329A
Publication Date:
April 22, 2020
Filing Date:
July 01, 2015
Export Citation:
Assignee:
KMEW Co., Ltd.
International Classes:
B28B3/20; B32B7/027; B32B13/00; C04B28/02
Domestic Patent References:
| JP10273356A | ||||
| JP2013203600A | ||||
| JP2004511685A | ||||
| JP2006063573A |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Yutaka Kimura