Title:
建築板
Document Type and Number:
Japanese Patent JP7104673
Kind Code:
B2
Abstract:
To provide a manufacturing method of a building board with strength to prevent creation of damages such as bending during handling even when formed using low specific gravity material.SOLUTION: A manufacturing method of a building board comprises a step of fitting a part of skin material forming a skin part 3 into a core material forming a core part 2 when patterning on an uncured front surface of the skin part 3 provided with: the core part 2 in a plate shape; and the skin part 3 integrated with the core part 2 by covering at least a front surface and a rear surface of the core part 2 by forming concave parts with press.SELECTED DRAWING: Figure 1
Inventors:
Hiroyuki Shiromoto
Takashi Komiya
Tomohisa Yamamoto
Takashi Komiya
Tomohisa Yamamoto
Application Number:
JP2019169492A
Publication Date:
July 21, 2022
Filing Date:
September 18, 2019
Export Citation:
Assignee:
KMEW Co., Ltd.
International Classes:
E04F13/14; B28B3/20
Domestic Patent References:
| JP2001162995A | ||||
| JP50096616A | ||||
| JP59132843U | ||||
| JP40000954B1 | ||||
| JP4173205A | ||||
| JP8169004A | ||||
| JP2002070282A |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office