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Title:
BUILDING STRUCTURE
Document Type and Number:
Japanese Patent JP2014025316
Kind Code:
A
Abstract:

To reduce a temperature change in an underfloor space by effectively using heat in the ground.

A building structure includes an underfloor space 5 enclosed by a foundation 2 and a floor 3. The foundation 2 is provided with a heat insulating material 8 which blocks heat transmitted from the outside of a building to the underfloor space 5. The underfloor space 5 is provided with a heat exchange part 21. The heat exchange part 21 includes an underground heat transmission part 23 formed of a material having excellent thermal conductivity. The underground heat transmission part 23 includes an outer underground heat transmission part 24 arranged on the foundation 2 side of the underfloor space 5, and an inner underground heat transmission part 25 arranged on the center side of the underfloor space 5. The lower end 24b of the outer underground heat transmission part 24 is located deeper in the ground than the lower end 25b of the inner underground heat transmission part 25.


Inventors:
NAKAGAWA HIROSHI
NISHIO KAZUNORI
TADOKORO SOJI
SATO HIROSHI
UMEMOTO DAISUKE
Application Number:
JP2012168707A
Publication Date:
February 06, 2014
Filing Date:
July 30, 2012
Export Citation:
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Assignee:
PANAHOME CORP
International Classes:
E04B1/76; F24F3/00; F24F5/00; F24J3/08
Domestic Patent References:
JPS5826965A1983-02-17
JPS59122854A1984-07-16
JP2011153764A2011-08-11
JP2009221758A2009-10-01
JPS5826965A1983-02-17
JPS59122854A1984-07-16
Foreign References:
GB2442803A2008-04-16
Attorney, Agent or Firm:
Sumitomo Shintaro



 
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