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Patent Searching and Data


Title:
建築システム
Document Type and Number:
Japanese Patent JP4637902
Kind Code:
B2
Abstract:
A building system is disclosed having building constituent assemblies including wall panels, a flooring assembly, a ceiling assembly and a roofing assembly. Each of the building constituent assemblies includes a supporting structure and a covering member. The supporting structure includes a supporting member which has a corrugated first side portion and second side portion. The side portions of adjacent supporting structures overlay each other and interlock the adjacent constituent assemblies together.

Inventors:
Madsen, Taige
Hansen, Claus, Hammershort
Application Number:
JP2007515728A
Publication Date:
February 23, 2011
Filing Date:
June 14, 2005
Export Citation:
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Assignee:
Tripod Components Pty Limited
International Classes:
E04C2/30; E04B1/08; E04B1/14; E04B2/56; E04B2/74; E04B5/02; E04B5/10; E04B7/00; E04B7/20; E04B9/00; E04C2/32; E04C2/38; E04D3/362
Domestic Patent References:
JP8135099A
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Yasushi Hayakawa
Ishikawa Takiharu