Title:
BULK MLCC CAPACITOR MODULE
Document Type and Number:
Japanese Patent JP2022119920
Kind Code:
A
Abstract:
To provide an electronic component package and a module that provide a specific function which can be incorporated into an electronic circuit assembly while including various electronic components.SOLUTION: An electronic component package 100 includes: a flat lead frame 4 that is a carrier member including a first conductive portion and a second conductive portion; and many electronic components 1n each of which includes a first external terminal end 2n that has at least one first longitudinal edge part, and a second external terminal end that has at least one second longitudinal edge part. The first longitudinal edge part of a first electronic component is connected with the first conductive portion by a first interconnect member. The second longitudinal edge part of the first electronic component is connected with the second conductive portion by a second interconnect member.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
GALEN W MILLER
JOHN E MCCONNELL
JOHN BULTITUDE
GARRY L RENNER
JOHN E MCCONNELL
JOHN BULTITUDE
GARRY L RENNER
Application Number:
JP2022087842A
Publication Date:
August 17, 2022
Filing Date:
May 30, 2022
Export Citation:
Assignee:
KEMET ELECTRONICS CORP
International Classes:
H01G2/02; H01C13/00; H01C13/02; H01G2/06; H01G2/10; H01G4/228; H01G4/30; H01G4/38; H01G4/40; H01G13/00; H01L25/065; H01L25/07; H01L25/16; H01L25/18; H05K1/03; H05K3/30
Attorney, Agent or Firm:
Patent Business Corporation Saegusa International Patent Office
Previous Patent: Receiver and receiving method
Next Patent: Video distribution method and distribution server
Next Patent: Video distribution method and distribution server