Title:
BUMP INSPECTION DEVICE
Document Type and Number:
Japanese Patent JP3969337
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a bump inspection device constituted so as to enhance the S/N ratio of an X-ray image to stably inspect a bump.
SOLUTION: An X-ray emitting device 16 is arranged and fixed under the substrate 2 supported on a substrate support mechanism 10 and a flat panel 20 as an X-ray detector is arranged above the substrate 2 so as to be opposed to the X-ray emitting device 16. The substrate 2 supported on the substrate support mechanism 10 is located at an inspection position by a movement control part 14 and X rays 18 emitted from the X-ray emitting device 16 transmit through the bump 4 of the substrate to be detected by the flat panel 20 and the X-ray image thereof is captured in an image processor 22 to determine the quality of the bump 4 such as the presence of the void of the bump 4 or the like.
Inventors:
Kamekawa Masayuki
Application Number:
JP2003109974A
Publication Date:
September 05, 2007
Filing Date:
April 15, 2003
Export Citation:
Assignee:
SHIMADZU CORPORATION
International Classes:
G01N23/04; G01R31/302; H05K3/34; (IPC1-7): G01N23/04; G01R31/302; H05K3/34
Domestic Patent References:
| JP2001358161A | ||||
| JP2002280727A | ||||
| JP2002202272A | ||||
| JP252246A | ||||
| JP20034668A | ||||
| JP430487Y2 | ||||
| JP377008A | ||||
| JP5251535A | ||||
| JP2002323460A | ||||
| JP2002318206A | ||||
| JP2934455B2 | ||||
| JP2925841B2 | ||||
| JP200262268A |
Attorney, Agent or Firm:
Shigeo Noguchi