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Title:
BUNDLING DEVICE BY BAND
Document Type and Number:
Japanese Patent JPH05254512
Kind Code:
A
Abstract:

PURPOSE: To obtain a bundling device of bands which facilitates a bundling work to fix a band at a bundling tool.

CONSTITUTION: A bundling tool C has an insertion chamber and a containing chamber of a band D and also has a fixing piece 17 in the insertion chamber and the containing chamber respectively. In the bundling device by use of the bundling tool C and the band D fixed on the bundling tool C, a container B of the band D is connected to the bundling device body A provided with a container 12c of the bundling tool C. A band guide face P2 against the band insertion clearance container chamber connected to the insertion chamber and a lock-off arm 7 closing to or separating from the flexible fixing piece 17 in the insertion chamber are provided respectively in the bundling device body A.


Inventors:
Kenji Tsuchiya
Suzuki Tohito
Application Number:
JP5153192A
Publication Date:
October 05, 1993
Filing Date:
March 10, 1992
Export Citation:
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Assignee:
Yazaki Corporation
International Classes:
B65B27/00; (IPC1-7): B65B27/00
Attorney, Agent or Firm:
Hideo Takino (1 outside)



 
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