To obtain a bundling material composed of a substrate film and an adhesive layer having a softening point lower than that of the substrate film, enabling easy bundling to give a compactly bundled product and useful for the bundling of electric cord, tube, pipe, etc.

This bundling material is composed of a substrate film 1 such as a nylon 6 film having a thickness of 0.1-0.3mm and an adhesive layer 2 having a softening point lower than that of the substrate film 1, e.g. a nylon 6 copolymer layer. Preferably, the bundling is carried out by winding the bundling material around a bundling object and partly welding the bundling material.