Title:
BUS BAR AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008258448
Kind Code:
A
Abstract:
To provide a semiconductor device having high reliability and high cooling performance.
The semiconductor device 10 is provided with semiconductor chips 11a, 11b on which a semiconductor element, an upper surface electrode 16 and a rear surface electrode 14 are formed; a metal wiring 23 connected to the rear surface electrodes 14; and bus bars 17, 18, 20 connected to the upper surface electrode 16 and the metal wiring 23. The bus bars 17, 18, 20 are each provided with a plate-like metal layer and a coupling portion for connecting the metal layers. The coupling portion is formed by, for example, spot welding, and thus, bus bars can be obtained that have proper flexibility and high reliability and are suitable to apply a large current.
Inventors:
ARIYOSHI TAKESHI
Application Number:
JP2007099878A
Publication Date:
October 23, 2008
Filing Date:
April 05, 2007
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01L23/48; H01L21/60
Domestic Patent References:
| JPH10302548A | 1998-11-13 | |||
| JP2006050830A | 2006-02-16 | |||
| JP2004319740A | 2004-11-11 |
Attorney, Agent or Firm:
Kawashima Masaaki
Seiichi Watanabe
Seiichi Watanabe
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