BUTYL ADHESIVE CONTAINING MALEIC ANHYDRIDE AND OPTIONAL NANOCLAY

Title:

BUTYL ADHESIVE CONTAINING MALEIC ANHYDRIDE AND OPTIONAL NANOCLAY

Document Type and Number:

Japanese Patent JP2008050606

Kind Code:

A

Abstract:

To provide a butyl adhesive containing maleic anhydride and optional nanoclay.

Disclosed are an adhesive polymer containing maleic anhydride-grafted butyl rubber, and a polymer compound produced from the adhesive polymer and furthermore containing functionalized silica nanoclay. The adhesive polymer and the polymer compound exhibit highly improved adhesiveness to the surface of a specific substrate. The substrate material includes stainless steel, glass, Mylar (R) and Teflon (R). The maximum adhesive force was observed in a polymer compound comprising maleic anhydride-grafted butyl rubber produced by a solution method and 5 to 15 phr of montmorillonite nanoclay. The adhesive force is improved by increasing the level of nanoclay content in the compound to a limit causing a filler-filler interaction.

Inventors:

AKHTAR OSMAN
KRISTA RAYNER

Application Number:

JP2007217374A

Publication Date:

March 06, 2008

Filing Date:

August 23, 2007

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Assignee:

LANXESS INC

International Classes:

C08F8/46; C09J113/00; C09J123/22; C09J123/26; C09J151/04

Domestic Patent References:

JP2006255812A	2006-09-28
JP2005068237A	2005-03-17
JP2009500501A	2009-01-08
JP2004091766A	2004-03-25
JP2006169266A	2006-06-29

Foreign References:

GB767068A

1957-01-30

Attorney, Agent or Firm:

Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro

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