Title:
ＳＴＩ用途のＣＭＰ組成物
Document Type and Number:
Japanese Patent JP7404255
Kind Code:
B2
Abstract:
The invention relates to a chemical-mechanical polishing composition comprising (a) ceria abrasive particles, (b) a cationic polymer, (c) a nonionic polymer comprising polyethylene glycol octadecyl ether, polyethylene glycol lauryl ether, polyethylene glycol oleyl ether, poly(ethylene)-co-poly(ethylene glycol), octylphenoxy poly(ethyleneoxy)ethanol, or a combination thereof, (d) a saturated monoacid, and (e) an aqueous carrier. The invention also relates to a method of polishing a substrate.
Inventors:
Sarah Brosnan
Application Number:
JP2020547167A
Publication Date:
December 25, 2023
Filing Date:
March 05, 2019
Export Citation:
Assignee:
CMC Materials Limited Liability Company
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| JP2001185514A | ||||
| JP2012129406A | ||||
| JP2015232083A | ||||
| JP2008172222A | ||||
| JP2015528842A |
Foreign References:
| WO2016143797A1 | ||||
| US20080081542 | ||||
| US20070281486 |
Attorney, Agent or Firm:
Atsushi Aoki
Shinji Mihashi
Kenji Kimura
Naonori Koda
Shinji Mihashi
Kenji Kimura
Naonori Koda
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