Title:
ＣＭＰ方法及びＣＭＰ用洗浄剤
Document Type and Number:
Japanese Patent JP7467188
Kind Code:
B2
Abstract:
According to one embodiment, a polishing method includes supplying a polishing agent to be between a polishing pad and to-be-polished surface, then polishing the to-be-polished surface with the polishing agent while rotating at least one of the to-be-polished surface and the polishing pad. The polishing agent includes abrasive grains and an organic polymer. The organic polymer makes a reversible phase transition between a gel state and a sol state depending on temperature.
Inventors:
Mikiya Sakashita
Yumiko Kataoka
Yukiteru Matsui
Yumiko Kataoka
Yukiteru Matsui
Application Number:
JP2020052315A
Publication Date:
April 15, 2024
Filing Date:
March 24, 2020
Export Citation:
Assignee:
Kioxia Corporation
International Classes:
B24B37/00; B24B37/015; B24B55/06; C09K3/14; H01L21/304
Domestic Patent References:
| JP2001077060A | ||||
| JP2019160996A | ||||
| JP2000208456A | ||||
| JP2018186118A | ||||
| JP2012126604A | ||||
| JP9255434A | ||||
| JP2015512959A |
Foreign References:
| US20190359855 |
Attorney, Agent or Firm:
Sakura International Patent Office
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