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Title:
超高スゥエル比の高分子材料を有する発泡プラスチック絶縁体を具えるケーブル
Document Type and Number:
Japanese Patent JP2007502526
Kind Code:
A
Abstract:
An electrical communications element having a foamed plastic insultation extruded about a conductor with no said insulation including at least one component with more than 20% by weight of an ultra-high die swell ratio polymer (UHDSRP), preferably around 15% by weight. The UHDSRP is defined as greater than 55% die swell ratio and more preferably greater than 65% die swell ratio. The insulation also preferably includes at least a second component with a high degree of stress crack resistance, such that the combination of (minimally) these polymers will yield an insulation layer that has a unique combination of physical propeties yielding a high degree of foaming, small uniform cell structure, characteristically lower attenuation, and stress crack resistance capable of withstanding greater than 100 hours at 100° C. while coiled at a stress level of 1 times the insulation outside diameter without failure (cracking).

Inventors:
Douglas Jay Blue
Eddy Earl Houston
Application Number:
JP2006532355A
Publication Date:
February 08, 2007
Filing Date:
March 30, 2004
Export Citation:
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Assignee:
COMMSCOPE,INC.OF NORTH CAROLINA
International Classes:
H01B7/02; B29C44/32; H01B3/44; H01B7/00; H01B7/285; H01B11/02; H01B11/18; H02B7/00
Domestic Patent References:
JPH07288047A1995-10-31
JPS5484288A1979-07-05
JP2001031792A2001-02-06
JP2002042555A2002-02-08
JP2001312922A2001-11-09
JP2000512796A2000-09-26
Attorney, Agent or Firm:
Kosaku Sugimura
Kazuaki Takami
Hiroshi Tokunaga
Yoshiyuki Iwasa
Shiro Fujitani
Kiyoshi Kuruma
Kazuyuki Tomita