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Title:
カメラモジュールおよびそのモールド回路基板組立体とモールド感光組立体並びに製造方法
Document Type and Number:
Japanese Patent JP7269273
Kind Code:
B2
Abstract:
A molding mould, comprising a first mould and a second mould that are able to be operated between an opened-mould position and a closed-mould position, wherein the first mould and the second mould are united to form at least one molding chamber therebetween when they are in the closed-mould position, wherein at least one light window forming block and a base forming guide groove disposed around the light window forming block are provided in the molding chamber of the molding mould, wherein when at least one circuit board is mounted in the molding chamber, a molding material filled in the base forming guide groove is solidified from a liquid state to a solid state under a temperature control, wherein a molded base is formed at a position corresponding to the base forming guide groove and a light window of the molded base is formed at a position corresponding to the light window forming block, wherein the molded base is integrally molded on the circuit board so as to form the molded circuit board assembly of the camera module, or the molded base is integrally molded on the circuit board and at least one portion of a non-photosensitive area portion of the photosensitive element so as to form the molded photosensitive assembly of the camera module.

Inventors:
King Pearl
Chen Zhenyu
Guo Kusunoki
Takehiko Tanaka
Zhao Nami Jie
Application Number:
JP2021055045A
Publication Date:
May 08, 2023
Filing Date:
March 29, 2021
Export Citation:
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Assignee:
Ning Hashun Umitsu Den
International Classes:
H01L27/146; G02B7/02; G02B7/04; G03B11/00; G03B17/02
Domestic Patent References:
JP2011233730A
JP2002198455A
JP2011060974A
JP2005026425A
JP7221278A
JP2008192996A
JP63197361A
JP2001292365A
JP1107560A
Foreign References:
US20050263312
CN105721754A
CN105681640A
Attorney, Agent or Firm:
Arima Momoko