Title:
CAMERA MODULE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2008153938
Kind Code:
A
Abstract:
To prevent dust or the like from sticking to an imaging surface during manufacturing a camera module.
An imaging chip 19 comprises a chip main body 25, the imaging surface 26 and input/output pads 27. Before manufacturing the camera module 11, a protective plate 20 is previously attached to the chip main body 25 via a spacer 38. The protective plate 20 is made of glass. The input/output pads 27 of the imaging chip 19 and the input/output pads 32 of a flexible substrate 18 are connected via a bump 35 by soldering. Thus, the imaging chip 19 is subjected to flip chip mounting on the flexible substrate 18. Underfill material 36 is filled up around the bump 35.
Inventors:
SASAKI KATSUHIRO
Application Number:
JP2006339835A
Publication Date:
July 03, 2008
Filing Date:
December 18, 2006
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
G03B17/02; H04N5/225; H04N5/335
Attorney, Agent or Firm:
Kazunori Kobayashi
Shigeru Iijima
Kobayashi Hideyoshi
Shigeru Iijima
Kobayashi Hideyoshi
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