Title:
CAP ELEMENT FOR CONNECTING DIGITAL EQUIPMENT
Document Type and Number:
Japanese Patent JP2007084641
Kind Code:
A
Abstract:
To provide a cap element for connecting digital equipment, excellent in chemical resistance, hinge properties and moldability.
As a material of cap elements for connecting digital equipment, a polyacetal resin composition having 300 MPa to 1,000 MPa flexural modulus is used. The polyacetal resin composition comprises (A) a polyacetal resin, (B) a polymer having at least one hydrogenated aromatic vinyl compound-conjugated diene compound random copolymer block and having ≤60°C principal dispersion peak of tanδ in viscoelastic spectrum, and (C) a polyolefin resin as an optional ingredient, wherein (A) is 10-99.5 pts.wt., (B)+(C) is 0.5-90 pts.wt. and (B)/(C) is 100/0-20/80.
Inventors:
OKA MIKIO
Application Number:
JP2005273240A
Publication Date:
April 05, 2007
Filing Date:
September 21, 2005
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L59/00; B65D43/16; C08L53/02
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Jun Komatsu
Norio Kagami
Jun Komatsu
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