To enhance the connection strength of a sensor chip to a circuit chip where the sensor chip is flip-chip-connected to the circuit chip via bumps.
The sensor chip 12 is kept facedown with respect to the circuit chip 13 and connected thereto by the four bumps 29. In this event, in addition to the bumps 29, eight dummy bumps 31 are provided between the sensor chip 12 and the circuit chip 13 for mechanically connecting the two to each other. Four of the dummy bumps 31 (dummy pads 23) are disposed at the respective apex parts of a fictive quadrangle formed with first to fourth fictive lines L1 to L4 while two of them are disposed along the third fictive line L3 so as to be positioned at midpoints between respective apices and a third electrode pad 21 and two of them are disposed along the fourth fictive line L4 so as to be positioned at midpoints between respective apices and a fourth electrode pad 22. X Y is a relation between the sum X of distances in an X-axis direction of the respective bumps 29 and the respective dummy bumps 31 from an original point O and the sum Y of distances thereof in the X-axis direction from the original point O.
| WO/1998/009174 | ACCELERATION LIMIT SENSOR |
| JP2020118609 | INERTIA SENSOR, ELECTRONIC APPARATUS, AND MOVABLE MEMBER |
| JPH07335278 | TERMINAL CONNECTING STRUCTURE |
MASUDA MICHIHIRO
KAYUKAWA KIMIJI
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