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Patent Searching and Data


Title:
容量性微小電気機械加速度計
Document Type and Number:
Japanese Patent JP6558466
Kind Code:
B2
Abstract:
The present disclosure describes a micromechanical accelerometer comprising a sensor for measuring acceleration along a vertical axis perpendicular to a substrate plane, and an accelerometer package with at least one inner package plane adjacent and parallel to the substrate plane. The first sensor comprises a rotor which is mobile in relation to the substrate, a rotor suspender and one or more stators which are immobile in relation to the substrate. The rotor is a seesaw frame where longitudinal rotor bar comprise one or more first deflection electrodes, and second deflection electrodes are fixed to the inner package plane above and/or below each of the one or more first deflection electrodes, so that they overlap. The accelerometer can be configured to perform a self-test by applying a test voltage to at least one first deflection electrode and at least one second deflection electrode. A self-test response signal can be read with a capacitive measurement between rotor and stator electrodes.

Inventors:
Matty Riuk
Ville-Pekka Rutkonen
Application Number:
JP2018080032A
Publication Date:
August 14, 2019
Filing Date:
April 18, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G01P21/00; G01P15/08; G01P15/125
Domestic Patent References:
JP2009500635A
JP2012163507A
JP2000028635A
Foreign References:
US7210352
Attorney, Agent or Firm:
Shuichi Yoshikawa
Masao Sakajima