To provide a capacitor incorporated in a circuit board, and to provide the circuit board incorporating the capacitor and a method for manufacturing them.
In the method, the capacitor that is a part of an electric circuit in manufacturing the circuit board is formed. A solid electrolyte layer formed of an organic semiconductor and an upper electrode layer formed on metal above the layer are collectively formed after a valve metal lower electrode layer and a valve metal oxide dielectric layer above it are formed. A collective forming process comprises a process for holding one face of metal foil for upper electrode by a pressing tool and pressing and supporting the powder of the organic semiconductor on the other face of the metal foil, and a process for forming the solid electrolyte layer formed of the organic semiconductor which is sandwiched between the metal foil and the dielectric layer and is closely bonded to them, by thermally pressing organic powder which is pressed and supported to the dielectric layer by the pressing tool through the metal foil.
| JP3019783 | DETECTOR OF PRINTED-BOARD TEMPERATURE |
| WO/2006/010317 | CONTROLLABLE ELECTROTHERMAL ELEMENT OF PTC THICK FILM CIRCUIT |
| JPS51129674 | LAYERED PRINTED SUBSTRATE |
MOCHIZUKI TAKASHI
AZUMA MITSUTOSHI
SANSHIN KK
Masaya Nishiyama
Higuchi Souji