To provide a capacity type MEMS sensor that does not require an additional process for forming a projection, and to provide a method of manufacturing the same.

A sacrifice layer 14 and a fixed electrode 15 are laminated on a diaphragm film 13 comprising a movable section. A through hole 17 is formed in the fixed electrode, and isotropic etching is carried out from the through hole. This leaves a part of the sacrifice layer on the diaphragm film at a position which is the most distant from the through hole. By using the part of the sacrifice layer as the projection 21, the movable section is prevented from being adhered to the fixed electrode.