Title:
CAPILLARY FOR WIRE BONDING DEVICE AND METHOD FOR FORMING ELECTRIC CONNECTION BUMP USING THE SAME
Document Type and Number:
Japanese Patent JP3022151
Kind Code:
B2
Abstract:
PURPOSE: To provide a wire bonding device which connects a semiconductor device with a circuit substrate, with ease and reliability, and a method for forming a bump, while the bump of desired height and shape is obtained with no extra levelling process, accompanied by shorter bump-formation time and less casts, relating to the process for forming a bump of a semiconductor device.
CONSTITUTION: Relating to a capillary 1 for ball-bonding for forming a bump 7 on an electrode pad 13 of a semiconductor device 6, a pressurizing member that pressurizes a ball-like tip of a metal wire 4 to an electrode pad 13 so that the tip is press-fixed to the pad 13, a draw-out hole 2 that, provided at the pressurizing member, supplies with the metal wire 4, and a levelling member 31 far uniforming the heights of bumps 7 formed on the electrode pad 13, are provided.
Inventors:
Yoshihiro Tomura
Yoshihiro Bessho
Yoshihiro Bessho
Application Number:
JP9100294A
Publication Date:
March 15, 2000
Filing Date:
April 28, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L21/321; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Yoshihiro Morimoto