Title:
キャリアテープの成形方法
Document Type and Number:
Japanese Patent JP6809678
Kind Code:
B2
Abstract:
The present invention is a method for molding a carrier tape (10) having one or more rows of perforations and accommodating recesses (3) that accommodate components. The method includes a conveying step for conveying a sheet material (10A) to a drum-type mold (120), and a molding step for drawing in the sheet material (10A) that has been conveyed to the surface of the drum-type mold (120) and performing vacuum molding. In the molding step, the sheet material (10A) is vacuum-molded while being heated by the blowing of hot air from a hot-air-heating means (160), and the blowing flow rate of the hot air is at least 0.125 mL/mm2 and no more than 3.75 mL/mm2 per unit area. The present invention makes it possible to provide a method for molding a carrier tape in which the rectangularity of an opening edge of an accommodating recess is ensured.
Inventors:
Masayuki Imai
Shiro Shiro
Shiro Shiro
Application Number:
JP2017096477A
Publication Date:
January 06, 2021
Filing Date:
May 15, 2017
Export Citation:
Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
B65B47/10; B29C51/10; B29C51/42; B65B15/04; B65B47/02
Domestic Patent References:
| JP11207811A | ||||
| JP11151749A | ||||
| JP2007126169A |
Attorney, Agent or Firm:
Tomohiro Sakamoto
Shinji Doi
Ayumi Yada
Toshihiro Oishi
Shinji Doi
Ayumi Yada
Toshihiro Oishi