Title:
チップ状電子部品用キャリアテープ台紙
Document Type and Number:
Japanese Patent JP7365321
Kind Code:
B2
Abstract:
To provide a carrier tape mount for chip-type electronic components that has low density and flexibility, and is less likely to generate paper dust when forming a recessed or perforated loading section for loading chip-type electronic components.SOLUTION: The present invention relates to a carrier tape mount for chip-type electronic components of multilayer papermaking having three or more layers of base paper, where each layer consists mainly of pulp, arranged in the order of a surface layer, a middle layer, and a back layer. The carrier tape mount for chip-type electronic components has: 1) the density of 0.88 g/cm3 or less; 2) 5 mass% or more of needle bleached kraft pulp (NBKP) in the pulp; 3) a rosin-based sizing agent in a content of 0.15% or less based on 100 pts.mass of pulp; 4) straight-chain fatty acid content of 1600 ppm or less.SELECTED DRAWING: None
Inventors:
Atsushi Tamura
Application Number:
JP2020204877A
Publication Date:
October 19, 2023
Filing Date:
December 10, 2020
Export Citation:
Assignee:
Hokuetsu Corporation Co., Ltd.
International Classes:
D21H27/00; B65D85/90; D21H15/00
Domestic Patent References:
| JP2009227327A | ||||
| JP2012136273A | ||||
| JP2011213419A | ||||
| JP2005179797A | ||||
| JP2005088900A | ||||
| JP2017133129A |
Attorney, Agent or Firm:
Mitsufumi Ezaki
Blacksmith Minoru Sawa
Katsuri Uenishi
Ichiro Torayama
Blacksmith Minoru Sawa
Katsuri Uenishi
Ichiro Torayama