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Title:
CARRIER FOR WAFER
Document Type and Number:
Japanese Patent JPH07302833
Kind Code:
A
Abstract:

PURPOSE: To prevent the generation of foreign matter caused by abrasion, by avoiding the abrasion of a wafer inside a carrier with the carrier when the carrier is subjected to vibration during transportation.

CONSTITUTION: A carrier comprises a main body 2 that stores wafers 1, an upper lid 13 that closes upper opening of the main body and a lower lid 14 that closes lower opening. Inside the main body 2, partition boards 15 that partition the inside of the main body 2 are arranged. Vibration absorbers 16 that support the wafer 1 elastically are arranged inside the upper and lower lids. The vibration absorbers 16 comprises supporting part 7 that supports the wafer 1, 2 leg parts 8 that are arranged on both sides of the supporting part 7 and with a convex to the outward, foot parts 9 that fix the vibration absorbers 16 to the upper lid 13 and the lower lid 14 engaging grooves 11 or 12 of the upper lid 13 and the lower lid 14 with the leg part 8. The leg parts 8 of the vibration absorbers 16 are spring structured. Slits 17 are arranged between the vibration absorbers 16 so that each unit of wafers can be supported independently.


Inventors:
MARUYAMA TAKATOSHI
AKIYAMA HIROKI
KOMATA CHIKAFUMI
Application Number:
JP9504594A
Publication Date:
November 14, 1995
Filing Date:
May 09, 1994
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
B65D85/86; B65G49/07; H01L21/673; H01L21/68; (IPC1-7): H01L21/68; B65D85/86; B65G49/07
Attorney, Agent or Firm:
Takashi Matsumoto



 
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