Title:
CASE FOR ELECTRONIC COMPONENT INCORPORATED IN SUBSTRATE
Document Type and Number:
Japanese Patent JP3688635
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a case for an electronic component incorporated in a substrate having such a structure as terminals are projected downward from the lower surface of the case in which the strength of the terminals can be sustained at a high level while reducing the size and facilitating manufacture.
SOLUTION: The case for an electronic component incorporated in a substrate comprises a flexible substrate 10 provided on one side of a synthetic resin film 11 with functional patterns 17 and 19 and a terminal connection pattern 23 connected with the functional patterns 17 and 19, and terminals 60 each having a bonding part 63 being connected with the terminal connection pattern 23 and a part 61 projecting from the bonding part 63. Under a state where the projecting part 61 of the terminal 60 is inserted into a terminal insertion hole 25 made through the flexible substrate 10 and projected to the underside thereof, the bonding part 63 of the terminal 60 abuts against the terminal connection pattern 23 and then the flexible substrate 10 and the terminal 60 are insert molded in a synthetic resin case 30.
Inventors:
Shigemasa Takahashi
Application Number:
JP2001391478A
Publication Date:
August 31, 2005
Filing Date:
December 25, 2001
Export Citation:
Assignee:
Teikoku Communication Industry Co., Ltd.
International Classes:
H05K5/00; H01C1/00; H01C1/02; H01C1/14; H01C10/00; H01H11/00; H01H15/02; H01H19/08; H05K7/14; (IPC1-7): H01C1/14
Domestic Patent References:
| JP2000183568A | ||||
| JP58037104U | ||||
| JP2000702U | ||||
| JP6249601A | ||||
| JP6351403U | ||||
| JP1166505A | ||||
| JP465411U |
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi
Yu Takagi