Title:
CASE FOR ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2014136357
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a case for electronic equipment capable of firmly integrating and improving appearance when a resin material is injection molded to an FRP plate consisting a thermoplastic resin as a parent material.SOLUTION: There is provided a case for electronic equipment 15 formed by making a prepreg thin plate 10 by coating a continuous fiber 11 with a thermoplastic resin 12, compression working the prepreg thin plate 10 with a press mold having convexoconcave on at least a part of surface to deform the continuous fiber 11 in the prepreg thin plate 10 to a rugged shape, removing the thermoplastic resin 12 by cutting work to expose the continuous fiber 11 positioning in a surface layer part of the deformed prepreg thin plate 10 to the surface layer part of the prepreg thin plate 10 with convex or concave, and laminating a resin material 14 containing a reinforced fiber 13 so that the continuous fiber 11 covers a surface of the exposed prepreg thin plate 10 with convex or concave.
Inventors:
ISHIZUKA MASANOBU
ABE TOMOYUKI
ABE TOMOYUKI
Application Number:
JP2013005638A
Publication Date:
July 28, 2014
Filing Date:
January 16, 2013
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B29C43/20; B29C43/02; B29C45/14; B29C51/08; B29K101/12; B29K105/08; B29L31/34
Domestic Patent References:
| JPH11320737A | 1999-11-24 | |||
| JPH0946082A | 1997-02-14 |
Attorney, Agent or Firm:
Atsushi Aoki
Koichi Itsubo
Higuchi Souji
Ryu Kobayashi
Koichi Itsubo
Higuchi Souji
Ryu Kobayashi
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