Title:
CASE FOR ELECTRONIC PARTS AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3818904
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a case for electronic components, wherein various electronic components such as sliding type electronic components can be easily assembled even if they are miniaturized, and to provide its manufacturing method.
SOLUTION: In this case 100 for electronic components, a component storage part 11 is formed between a lower case 10 and an upper case 70 by covering the upper case 70 on the lower case 10. The lower case 10 is made of a molding resin and one end part of the upper case 70 is insert-molded to fix it. The upper case 70 can be covered on the lower case 10 by bending a part protruding from the part fixed to the lower case 10. A slider abutting pattern 27 (33, 37) exposed in the component storage part 11 and conductive members 25, 30, 35 having lead-out parts 29, 32, 39 protruding to the outside of the lower case 10 are insert-molded in the lower case 10.
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Inventors:
Suyama Shinji
Application Number:
JP2001374165A
Publication Date:
September 06, 2006
Filing Date:
December 07, 2001
Export Citation:
Assignee:
Teikoku Communication Industry Co., Ltd.
International Classes:
H01H15/02; (IPC1-7): H01H15/02
Domestic Patent References:
| JP2117627U |
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi
Yu Takagi
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