Title:
ケースモールド型コンデンサ
Document Type and Number:
Japanese Patent JP5903560
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a case molded capacitor used on hybrid automobiles or the like with an enhanced reliability.SOLUTION: The case molded capacitor has bus bars 2 and 3 which are constituted including: an electrode connection part 2a connected to an electrode; an external connection terminal 2b connected to the external; and a link portion 2c linking the electrode connection part 2a and the external connection terminal 2b. A part of the link portion of at least one bus bar 2(3) is a formed in a comb-teeth portion 2 g (3 g) in contact with a molding resin, and in which neighboring comb-teeth are arranged not to overlap with each other in a side view. This constitution prevents a local stress from occurring in the molding resin even when the molding resin is subjected to a thermal shock; to thereby prevent the molding resin from clacking due to a thermal shock. As a result, the reliability of the case molded capacitor is enhanced.
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Inventors:
Satoshi Hosokawa
Kazuhiro Nakatsubo
Toshihisa Miura
Kazuhiro Nakatsubo
Toshihisa Miura
Application Number:
JP2012079152A
Publication Date:
April 13, 2016
Filing Date:
March 30, 2012
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H01G4/228; H01G2/04; H01G2/10; H01G4/18; H01G4/38
Domestic Patent References:
| JP2005085880A | ||||
| JP2010056120A | ||||
| JP2003100959A | ||||
| JP2011096917A | ||||
| JP2007201117A |
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda
Kenji Kamada
Hiroo Maeda