Title:
CASE STRUCTURE OF ONBOARD ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP3748253
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic substrate for an onboard electronic apparatus which is excellent in heat radiation characteristics/waterproofness/heat resistance/vibration proofness.
SOLUTION: An electronic substrate 7 is temporarily secured to the annular peripheral wall 6 of a cover 1 of frame retardant resin. A connector connection pin 2 is soldered to the electronic substrate 7. The electronic substrate 7 is sandwiched between a heat-conductive base 8 and the annular peripheral wall 6 and screwed for fixing. A generated heat of a heating component 9 on the electronic substrate 7 is propagated and dispersed in the base 8. The annular peripheral wall 6 is provided with an annular groove 6a in which a sealing material 11 is inserted. The base 8 is provided with an annular protrusion 13 which engages with the annular groove 6a.
Inventors:
Azumi Isao
Tetsuji Watanabe
Tetsuji Watanabe
Application Number:
JP2002330178A
Publication Date:
February 22, 2006
Filing Date:
November 14, 2002
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H02G3/16; B60R16/02; B60R16/023; H05K5/00; H05K5/06; H05K7/20; (IPC1-7): H02G3/16
Domestic Patent References:
| JP2025096A | ||||
| JP8148842A | ||||
| JP11166639A | ||||
| JP8153986A | ||||
| JP8201072A | ||||
| JP8079936A | ||||
| JP2002320313A | ||||
| JP2000178417A | ||||
| JP2002299867A |
Attorney, Agent or Firm:
Keigo Murakami
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo
Masuo Oiwa
Toshihide Kodama
Takenaka Ikuo